Polyset 4000

POLYSET™ 4000 is a unique, difunctional, high molecular weight, bismaleimide resin. At ambient temperature, POLYSET™ 4000 is thermoplastic. However, at temperatures in excess of 100° C (in the presence of a suitable free radical catalyst) thermoset cure will occur.  POLYSET™ 4000 exhibits excellent low shrinkage properties, high hydrolytic stability, and high thermal stability (TGA decomposition onset is in excess of 400° C).

POLYSET™ 4000 is recommended for adhesive applications and can be used as an additive to promote adhesion to difficult substrates such as polyolefins, aluminum, and other metals. POLYSET™ 4000 is incompatible with ketones. It can be dissolved in aromatic solvents and, under heat (80° C), it will dissolve into reactive diluents such as isobornyl acrylate.